| 3D chip-package-board modeling: advanced computing languages will help to develop flexible solver architectures and efficient simulation methods.(SYSTEM ... article from: Printed Circuit Design & Fab |  | Authors: Vikram Jandhyala, Dipanjan Gope, Swagato Chakraborty, Feng Ling, Xiren Wang, Devan Williams, James Pingenot
Publisher: UP Media Group, Inc.
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This digital document is an article from Printed Circuit Design & Fab, published by UP Media Group, Inc. on November 1, 2008. The length of the article is 2612 words. The page length shown above is based on a typical 300-word page. The article is delivered in HTML format and is available immediately after purchase. You can view it with any web browser.
Citation Details
Title: 3D chip-package-board modeling: advanced computing languages will help to develop flexible solver architectures and efficient simulation methods.(SYSTEM MODELING)
Author: Vikram Jandhyala
Publication: Printed Circuit Design & Fab (Magazine/Journal)
Date: November 1, 2008
Publisher: UP Media Group, Inc.
Volume: 25 Issue: 11 Page: 24(4)
Distributed by Gale, a part of Cengage Learning
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